Liquid cooling systems are becoming increasingly crucial for AI and High-Performance Computing (HPC) data centers due to the high heat generated by these workloads. These methods offer significant advantages over traditional air cooling, including improved energy efficiency, enhanced performance, and reduced environmental impact.
Data center liquid cooling solutions offer a more efficient and effective way to manage heat generated by high-density computing equipment compared to traditional air cooling. These solutions involve using liquids, like water or specialized coolants, to absorb and dissipate heat directly from servers and other components, enabling higher performance and greater energy efficiency
From Design to Manufacturing, from selection to materials, from CNC process to Quality Inspection, Reliability Assurance is integrated into every detail.
Liquid cooling system is a critical support system. We always put the safety and reliability of the system first, so that customers no longer have to worry about leakage, downtime and other risks caused by process problems. From system reliability, multi-level protection of risk points to advanced and mature molding technology, we ensure the reliability of the system.
With nearly 20 years of experience in manufacturing liquid cooling core components, we understand modular design and manufacturing, short customization development cycle, and fast construction delivery.
Cold plate type Liquid cooling system main parts:
Liquid cold plates + liquid cooling loops + Manifolds + Liquid Cooled Chassis & Enclosures + CDU.
| Name | Parameter |
|---|---|
| Material | Cooper or Aluminum |
| QDs Material | T2 Cooper/304 SS |
| Pipe Material | EPDM/PTFE/Cooper/SS |
| Pressure Resistance | ≥ 1MPa |
| Coolant | Propylene Glycol/Ethylene glycol/Pure water |
| Leakage Detection | Rope Leak Detection |
| Thermal Resistance | ≤0.01°C/W |
| Platform | Intel EGS/Whitley, OEM welcome |